HSN Code 84561000: Dry-Etching Semiconductor Machine-Tools

HSN Code 84561000 represents Dry-Etching Semiconductor Machine-Tools under GST classification. This code helps businesses identify Dry-Etching Semiconductor Machine-Tools correctly for billing, taxation, and trade. With HSN Code 84561000, companies can avoid errors in invoices, simplify compliance, and enable hassle-free import/export of Dry-Etching Semiconductor Machine-Tools.

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Description of Goods for Dry-Etching Semiconductor Machine-Tools

HSN Code 84561000 relates to the following description:

Chapter Number Chapter Name Sub Chapter Number Sub Chapter Name Description of Goods CGST
(%)
SGST
(%)
IGST
(%)
CESS
(%)
84 Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof 8456 Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electrodischarge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water- jet cutting machines Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - operated by laser or other light or photonbeam processes 9% 9% 18% 0%

Description of goods

Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - operated by laser or other light or photonbeam processes

Chapter

84 – Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof

Sub Chapter

8456 – Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electrodischarge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water- jet cutting machines

CGST 9%
SGST 9%
IGST 18%
CESS 0%

What does HSN Code 84561000 not include?

Dry-Etching Semiconductor Machine-Tools does not include products with the following descriptions:

HSN Code Description
Operated by laser or other light or photon beam processes: Operated by laser
Operated by laser or other light or photon beam processes: Operated by laser
Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes
Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes
Operated by ultrasonic processes
Operated by ultrasonic processes
Operated by electro-discharge processes
Operated by electro-discharge processes
Operated by plasma arc processes
Operated by plasma arc processes
Water-jet cutting machines
Water-jet cutting machines
Other : For dry-etching patterns on semi-conductor materials
Other : For dry-etching patterns on semi-conductor materials
Other : Electro-chemical machines
Other : Electro-chemical machines
Other : Other
Other : Other
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: for dry-etching patterns on semi-conductor materials
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - electro chemical machines
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - other

Operated by laser or other light or photon beam processes: Operated by laser

Operated by laser or other light or photon beam processes: Operated by laser

Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes

Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes

Operated by ultrasonic processes

Operated by ultrasonic processes

Operated by electro-discharge processes

Operated by electro-discharge processes

Operated by plasma arc processes

Operated by plasma arc processes

Water-jet cutting machines

Water-jet cutting machines

Other : For dry-etching patterns on semi-conductor materials

Other : For dry-etching patterns on semi-conductor materials

Other : Electro-chemical machines

Other : Electro-chemical machines

Other : Other

Other : Other

Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: for dry-etching patterns on semi-conductor materials

Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - electro chemical machines

Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - other

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FAQs for HSN Code 84561000

What products are classified under HSN 84561000 ?

It includes Bar and Angle Shearing/Cropping Machines

How much GST applies to Dry-Etching Semiconductor Machine-Tools?

Under HSN 84561000, Dry-Etching Semiconductor Machine-Tools attracts Varies when sold in taxable form. Describe the exact form on the invoice.

Does packaging or labelling change the GST for Dry-Etching Semiconductor Machine-Tools?

For food/agri items, GST can be 5% when not fresh/chilled and sold as pre‑packaged & labelled; otherwise often Nil. For non‑food items, rates depend on the specific sub‑heading.

How should mixed supplies be billed when Dry-Etching Semiconductor Machine-Tools is sold with other items?

Use separate invoice lines per HSN and apply the correct rate per line (e.g., Varies for Dry-Etching Semiconductor Machine-Tools; Nil for exempt items if applicable).

Any common misclassification issue with Dry-Etching Semiconductor Machine-Tools?

Use the exact HSN and describe the form/grade. For multi‑line invoices, apply the rate per line to avoid wrong tax collection.

Can we claim ITC on inputs used to trade Dry-Etching Semiconductor Machine-Tools?

If your outward supply is taxable, eligible ITC is available subject to general restrictions. For exempt/Nil supplies, reverse credit per Rule 42.

Important Disclaimer

The above does not constitute professional advice or a formal recommendation. We recommend consulting a professional tax consultant before acting on the information contained in this piece of content.

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