What products are classified under HSN 84561200 ?
It includes Dry-etching patterns on semi-conductor materials
HSN Code 84561200 represents Machinery for Making Electronic Integrated Circuits under GST classification. This code helps businesses identify Machinery for Making Electronic Integrated Circuits correctly for billing, taxation, and trade. With HSN Code 84561200, companies can avoid errors in invoices, simplify compliance, and enable hassle-free import/export of Machinery for Making Electronic Integrated Circuits.
HSN Code 84561200 relates to the following description:
| Chapter Number | Chapter Name | Sub Chapter Number | Sub Chapter Name | Description of Goods | CGST (%) |
SGST (%) |
IGST (%) |
CESS (%) |
|---|---|---|---|---|---|---|---|---|
| 84 | Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof | 8456 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electrodischarge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water- jet cutting machines | Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes | 9% | 9% | 18% | 0% |
| 84 | Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof | 8456 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electrodischarge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water- jet cutting machines | Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes | 9% | 9% | 18% | 0% |
Description of goods
Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes
Chapter
84 – Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
Sub Chapter
8456 – Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electrodischarge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water- jet cutting machines
Description of goods
Operated by laser or other light or photon beam processes: Operated by other light or photon beam processes
Chapter
84 – Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
Sub Chapter
8456 – Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electrodischarge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water- jet cutting machines
Machinery for Making Electronic Integrated Circuits does not include products with the following descriptions:
| HSN Code | Description |
|---|---|
| Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - operated by laser or other light or photonbeam processes | |
| Operated by laser or other light or photon beam processes: Operated by laser | |
| Operated by laser or other light or photon beam processes: Operated by laser | |
| Operated by ultrasonic processes | |
| Operated by ultrasonic processes | |
| Operated by electro-discharge processes | |
| Operated by electro-discharge processes | |
| Operated by plasma arc processes | |
| Operated by plasma arc processes | |
| Water-jet cutting machines | |
| Water-jet cutting machines | |
| Other : For dry-etching patterns on semi-conductor materials | |
| Other : For dry-etching patterns on semi-conductor materials | |
| Other : Electro-chemical machines | |
| Other : Electro-chemical machines | |
| Other : Other | |
| Other : Other | |
| Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: for dry-etching patterns on semi-conductor materials | |
| Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - electro chemical machines | |
| Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - other |
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - operated by laser or other light or photonbeam processes
Operated by laser or other light or photon beam processes: Operated by laser
Operated by laser or other light or photon beam processes: Operated by laser
Operated by ultrasonic processes
Operated by ultrasonic processes
Operated by electro-discharge processes
Operated by electro-discharge processes
Operated by plasma arc processes
Operated by plasma arc processes
Water-jet cutting machines
Water-jet cutting machines
Other : For dry-etching patterns on semi-conductor materials
Other : For dry-etching patterns on semi-conductor materials
Other : Electro-chemical machines
Other : Electro-chemical machines
Other : Other
Other : Other
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: for dry-etching patterns on semi-conductor materials
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - electro chemical machines
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electrochemical, electron beam, ionic-beam or plasma arc processes - other: other - other
It includes Dry-etching patterns on semi-conductor materials
Use the exact HSN and describe the form/grade. For multi‑line invoices, apply the rate per line to avoid wrong tax collection.
Use separate invoice lines per HSN and apply the correct rate per line (e.g., Varies for Machinery for Making Electronic Integrated Circuits; Nil for exempt items if applicable).
If your outward supply is taxable, eligible ITC is available subject to general restrictions. For exempt/Nil supplies, reverse credit per Rule 42.
For food/agri items, GST can be 5% when not fresh/chilled and sold as pre‑packaged & labelled; otherwise often Nil. For non‑food items, rates depend on the specific sub‑heading.
e‑Way bill is needed above ₹50,000 consignment value (subject to exemptions). e‑Invoicing is turnover‑based (presently AATO > ₹5 crore) for B2B supplies.
The above does not constitute professional advice or a formal recommendation. We recommend consulting a professional tax consultant before acting on the information contained in this piece of content.